Soft Gold MCP / CSP Package Substrate BT FR4 0.1 - 0.4mm Finished Thickness

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Soft Gold MCP / CSP Package Substrate BT FR4 0.1 - 0.4mm Finished Thickness

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Soft Gold MCP / CSP Package Substrate BT FR4 0.1 - 0.4mm Finished Thickness

Soft gold MCP/CSP package substrate manufacture supporting MCP (Multi-Chip Package) MCP is the structure that increases memory capacity and performance, and maximizes the foot print efficiency by ...

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Soft Gold CSP Package Substrate

apparatus CSP Package Substrate

Soft Gold MCP Package Substrate

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