BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly

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HongRuiXing (Hubei) Electronics Co.,Ltd.

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City: Shenzhen

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BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly

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BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly

FCCSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electronics,Computer,others; ...

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Green FCCSP Package Substrate

3x3mm FCCSP Package Substrate

0.3mm FCCSP Package Substrate

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