BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly

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BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly

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BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly

FCCSP package substrate production supporting Product description IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBS. Additionally, the ...

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Green Color FCCSP Package Substrate

Flip Chip FCCSP Package Substrate

BT FCCSP Substrate

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