L/S 30um BT Wire Bonding Substrate UL ENIG Hard Gold Soft Gold

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HongRuiXing (Hubei) Electronics Co.,Ltd.

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City: Shenzhen

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L/S 30um BT Wire Bonding Substrate UL ENIG Hard Gold Soft Gold

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L/S 30um BT Wire Bonding Substrate UL ENIG Hard Gold Soft Gold

Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0...

Product Tags:

BT Wire Bonding Substrate

35um Line Wire Bonding Substrate

UL ENIG IC Package Substrate

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