finleLine Space IC Package Substrate for Wearable and Automotive Electronics

Product Categories

HongRuiXing (Hubei) Electronics Co.,Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

HongRuiXing (Hubei) Electronics Co.,Ltd.

Visit Website

City: Shenzhen

Country/Region: China

View Contact Details

finleLine Space IC Package Substrate for Wearable and Automotive Electronics

Contact Now

finleLine Space IC Package Substrate for Wearable and Automotive Electronics

Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -...

Product Tags:

FBGA IC Packaging Substrate

FR4 IC Packaging Substrate

FBGA Semiconductor Substrate

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	HongRuiXing (Hubei) Electronics Co.,Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!