semiconductor FCCSP Package Substrate manufacture

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HongRuiXing (Hubei) Electronics Co.,Ltd.

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City: Shenzhen

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semiconductor FCCSP Package Substrate manufacture

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semiconductor FCCSP Package Substrate manufacture

Application:FCCSP package,IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; ...

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